Light-emitting sensor device and method for manufacturing the same

ABSTRACT

A light-emitting sensor device is provided with: a substrate ( 110 ); an irradiating part ( 120 ), disposed on the substrate, for applying light to a specimen; a light receiving part ( 150 ), disposed on the substrate, for detecting light from the specimen caused by the applied light; a front plate ( 190 ) disposed to face the substrate, on a front surface side of the substrate in which the irradiating part is disposed; and an adhesive part ( 180 ) which is formed to surround each of the irradiating part and the light receiving part viewed in a two-dimensional manner on the substrate, which includes a light shielding adhesive, and which bonds the substrate and the front plate to each other. By this, the light-emitting sensor device is suitable for mass production, and it is possible to detect a predetermined type of information, such as a blood flow velocity, on a specimen, highly accurately.

TECHNICAL FIELD

The present invention relates to a light-emitting sensor device capableof measuring a blood flow velocity or the like, and a method of makingthe same.

BACKGROUND ART

As this type of light-emitting sensor device, there is a device forapplying light such as laser light to a living body and for calculatingthe blood flow velocity of the living body from a change in wavelengthby Doppler shift in its reflection or scattering (e.g. refer to patentdocuments 1 and 2). In this type of light-emitting sensor device,typically, miniaturization is expected by providing a light source suchas a semiconductor laser for applying light to a living body and a lightdetector such as a photodiode for detecting light from the living bodyto be close to each other, in an enclosure or housing. Moreover, in mostcases, such a light-emitting sensor device has a light shieldingstructure for preventing light which should not be detected, such aslight directly going to the light detector without being applied to theliving body, out of light from the light source from being detected bythe light detector. Such a light shielding structure is realized in apatent document 1 by providing a light shielding plate between thesemiconductor laser and the photodiode in the enclosure. In a patentdocument 2, the light shielding structure is realized by separatelydisposing the semiconductor laser and the photodiode in each of twoconcave portions formed by performing an anisotropy process on a siliconsubstrate and forming a light shielding film on the inner surface of theconcave portion.

-   Patent document 1: Japanese Patent Application Laid Open No.    2004-357784-   Patent document 2: Japanese Patent Application Laid Open No.    2004-229920

DISCLOSURE OF INVENTION Subject to be Solved by the Invention

However, for example, according to the technologies disclosed in thepatent documents 1 and 2, the light-emitting sensor device including theaforementioned light shielding structure has a complicated structure, sothat there is such a technical problem that processes requiring a lot oftime increase and the number of the processes increases in amanufacturing process. Thus, a yield in the manufacturing process likelydecreases, resulting in an increase in manufacturing cost of the device.

For example, in the technology disclosed in the patent document 1, it isnecessary to incorporate relatively many parts in the enclosureincluding the aforementioned light shielding plate, a reflection platefor guiding the light from the semiconductor laser to the living bodyside, a reflective plate for guiding the light from the living body tothe photodiode side, or the like in addition to the semiconductor laserand the photodiode. Thus, the number of processes likely increases, andit likely requires a lot of time for the positioning of the parts.Moreover, in the technology disclosed in the patent document 2, forexample, a small sensor device which is several millimeters×severalmillimeters in size can be realized; however, it likely takes a lot oftime to perform the anisotropy etching process for forming the concaveportion on the silicon substrate, and the yield likely decreases due tovariations in the manufacture caused by the anisotropy etching process.

In view of the aforementioned problems, it is therefore an object of thepresent invention to provide a small light-emitting sensor device, whichis suitable for mass production and which can detect a predeterminedtype of information such as a blood flow velocity on a specimen, highlyaccurately, and its manufacturing method.

Means for Solving the Subject

The above object of the present invention can be achieved by alight-emitting sensor device provided with: a substrate; an irradiatingpart, disposed on the substrate, for applying light to a specimen; alight receiving part, disposed on the substrate, for detecting lightfrom the specimen caused by the applied light; a front plate disposed toface the substrate, on a front surface side of the substrate in whichthe irradiating part is disposed; and an adhesive part which is formedto surround each of the irradiating part and the light receiving partviewed in a two-dimensional manner on the substrate, which includes alight shielding adhesive, and which bonds the substrate and the frontplate to each other.

According to the light-emitting sensor device of the present invention,in its detection, the light such as laser light is applied to thespecimen, which is one portion of a living body, by the irradiating partincluding e.g. a semiconductor laser. The light from the specimen causedby the light applied to the specimen in this manner is detected by thelight receiving part including e.g. a light receiving element. Here, the“light from the specimen caused by the light applied to the specimen”means light caused by the light applied to the specimen, such as lightsreflected, scattered, diffracted, refracted, transmitted through,Doppler-shifted in the specimen and interfering light by the abovelights. On the basis of the light detected by the light receiving part,it is possible to obtain predetermined information such as a blood flowvelocity associated with the specimen.

Incidentally, the front plate is made of a light shielding plate-likemember where an exit aperture for transmitting the light emitted fromthe irradiating part and an entrance aperture for transmitting the lightfrom the specimen are formed.

In the present invention, in particular, the substrate on which theirradiating part and the light receiving part are formed and the frontplate are bonded to each other by the adhesive part including the lightshielding adhesive. Moreover, the adhesive part is formed to surroundeach of the irradiating part and the light receiving part viewed in atwo-dimensional manner on the substrate.

Thus, the adhesive part can surely bond the substrate and the frontplate. Moreover, by virtue of the adhesive part, it is possible toprevent unnecessary light from the surroundings of the light-emittingsensor device from entering the irradiating part and the light receivingpart. In addition, by virtue of the adhesive part, it is possible toblock the light directly going from the irradiating part to the lightreceiving part, out of the light emitted from the irradiating part (i.e.the light which is emitted from the irradiating part and which goes tothe light receiving part without being applied to the specimen).Therefore, it is possible to prevent that the light detected by thelight receiving part changes due to the unnecessary light from thesurroundings of the light-emitting sensor device and the light directlygoing from the irradiating part to the light receiving part. As aresult, it is possible to detect the predetermined type of information,such as a blood flow velocity, on the specimen, more highly accurately.Incidentally, the adhesive part can also function as a spacer fordefying a gap between the substrate and the front plate.

Moreover, particularly in the present invention, as described above, thesubstrate and the front plate are bonded to each other by the adhesivepart. In other words, the light-emitting sensor device of the presentinvention has a laminated structure in which the substrate on which theirradiating part and the light receiving part are formed and the frontplate are laminated via the adhesive part. Thus, in manufacturing thelight-emitting sensor device of the present invention, for example,after the irradiating part and the light receiving part are formed on aflat substrate surface on the substrate, the front plate may be bondedto the substrate by the adhesive part.

In other words, the light-emitting sensor device of the presentinvention has a relatively simple structure, which is a laminatedstructure, in which the substrate and the front plate are laminated bythe adhesive part, so that it is possible to simplify or reduce eachprocess in a manufacturing process. Thus, it is possible to increase theyield and to reduce the manufacturing cost as well.

As explained above, according to the light-emitting sensor device of thepresent invention, it is possible to detect the predetermined type ofinformation, such as a blood flow velocity, on the specimen, highlyaccurately. Moreover, it is possible to increase the yield and to reducethe manufacturing cost, and it is suitable for mass production.

In one aspect of the light-emitting sensor device of the presentinvention, the adhesive part is made only of the light shieldingadhesive.

According to this aspect, the structure of the adhesive part isrelatively simple, so that it is possible to simplify, for example, aprocess of forming the adhesive part. Thus, it is possible to furtherincrease the yield and to further reduce the manufacturing cost as well.

In another aspect of the light-emitting sensor device of the presentinvention, the adhesive part includes a frame member which has higherstrength than the light shielding adhesive and which surrounds each ofthe irradiating part and said light receiving part viewed in atwo-dimensional manner on the substrate.

According to this aspect, it is possible to increase the strength of theadhesive part. Thus, for example, the function as the spacer of theadhesive part can be increased. Therefore, it is possible to limit orcontrol a change in the gap between the substrate and the front plate.

In another aspect of the light-emitting sensor device of the presentinvention, the light shielding adhesive is an acrylic, epoxy, polyimideor silicon type adhesive in which light shielding particles aredispersed inside.

According to this aspect, the adhesive part includes the acrylic, epoxy,polyimide or silicon type adhesive in which the light shieldingparticles are dispersed inside, as the light shielding adhesive. Thus,the adhesive part can surely bond the substrate and the front plate.Moreover, by virtue of the adhesive part, it is possible to prevent theunnecessary light from the surroundings of the light-emitting sensordevice from entering the irradiating part and the light receiving part.In addition, by virtue of the adhesive part, it is possible to surelyblock the light directly going from the irradiating part to the lightreceiving part, out of the light emitted from the irradiating part.Incidentally, as the light shielding particles, conducting particles,such as carbon black, aluminum and silver, and black pigments can belisted.

In another aspect of the light-emitting sensor device of the presentinvention, the irradiating part and the light receiving part areintegrated on the substrate.

According to this aspect, the irradiating part and the light receivingpart are integrated, so that the layout area for each part is reduced,which further allows miniaturization. Due to the miniaturization, it ispossible to extend the use of the light-emitting sensor device, such asmaking it not of a stationary type but a mobile type.

In another aspect of the light-emitting sensor device of the presentinvention, it is further provided with a calculating part forcalculating a blood flow velocity associated with the specimen, on thebasis of the detected light.

According to this aspect, by using that the penetration force of lightto a living body depends on wavelength, it is possible to measure theblood flow velocity of each of blood vessels which have different depthfrom the skin surface. Specifically, by applying light to the surface ofa living body, the light penetrating into the body is reflected orscattered by red blood cells flowing in the blood vessel, and itswavelength changes due to the Doppler-shift according to the transferrate of the red blood cells. On the other hand, as for the lightreflected or scattered by skin tissue which can be considered immovablewith respect to the red blood cells, the light reaches to the lightreceiving part without any change in the wavelength. By those lightsinterfering with each other, an optical beat signal corresponding to theDoppler shift amount is detected on the light receiving part. Thecalculating part performs an arithmetic process, such as frequencyanalysis, on the optical beat signal, thereby calculating the velocityof the blood flowing in the blood vessel.

In another aspect of the light-emitting sensor device of the presentinvention, the irradiating part has a semiconductor laser for generatinglaser light as the light.

According to this aspect, the laser light can be applied by applying avoltage to the semiconductor of the irradiating part such that anelectric current flows with a higher value than a laser oscillationthreshold value. The laser light has such a character that it has adifferent penetration force to a living body or the like depending on adifference in wavelength. By using such a character, it is possible toperform the measurement in different depth of the specimen.

The above object of the present invention can be also achieved by afirst method of manufacturing a light-emitting sensor device providedwith: a substrate; an irradiating part, disposed on the substrate, forapplying light to a specimen; a light receiving part, disposed on thesubstrate, for detecting light from the specimen caused by the appliedlight; a front plate disposed to face the substrate, on a front surfaceside of the substrate in which the irradiating part is disposed; and anadhesive part which is formed to surround each of the irradiating partand the light receiving part viewed in a two-dimensional manner on thesubstrate, which includes a light shielding adhesive, and which bondsthe substrate and the front plate to each other, the method providedwith: a forming process of forming the irradiating part and the lightreceiving part on a first large substrate including a plurality ofsubstrates; an applying process of applying the light shielding adhesiveso as to surround each of the irradiating part and the light receivingpart on the first large substrate; an adhering process of disposing asecond large substrate including a plurality of front plates so as toface the first large substrate to which the light shielding adhesive isapplied and of bonding the first and second large substrates to eachother by the light shielding adhesive; and a cutting process of cuttingthe first and second large substrates bonded to each other, alongcircumference of the substrate.

According to the first method of manufacturing a light-emitting sensordevice of the present invention, the aforementioned light-emittingsensor device of the present invention can be manufactured. Here, inparticular, the light shielding adhesive is applied, for example, byusing a dispenser (an apparatus for discharging a certain amount ofliquid) so as to surround each of the irradiating part and the lightreceiving part on the first large substrate. Moreover, after the firstand second large substrates are bonded to each other, the first andsecond large substrates are cut along the circumference of thesubstrate. Thus, it is possible to manufacture a plurality oflight-emitting sensor devices, simultaneously.

The above object of the present invention can be also achieved by asecond method of manufacturing a light-emitting sensor device providedwith: a substrate; an irradiating part, disposed on the substrate, forapplying light to a specimen; a light receiving part, disposed on thesubstrate, for detecting light from the specimen caused by the appliedlight; a front plate disposed to face the substrate, on a front surfaceside of the substrate in which the irradiating part is disposed; and anadhesive part which is formed to surround each of the irradiating partand the light receiving part viewed in a two-dimensional manner on thesubstrate, which includes a light shielding adhesive, and which bondsthe substrate and the front plate to each other, the method providedwith: a forming process of forming the irradiating part and the lightreceiving part on a first large substrate including a plurality ofsubstrates; a disposing process of disposing an adhesive sheet on thefirst large substrate, the adhesive sheet being formed to surround eachof the irradiating part and the light receiving part on the first largesubstrate, the adhesive sheet being made of the light shieldingadhesive; an adhering process of disposing a second large substrateincluding a plurality of front plates so as to face the first largesubstrate on which the adhesive sheet is disposed and of bonding thefirst and second large substrates to each other by the adhesive sheet;and a cutting process of cutting the first and second large substratesbonded to each other, along circumference of the substrate.

According to the second method of manufacturing a light-emitting sensordevice of the present invention, the aforementioned light-emittingsensor device of the present invention can be manufactured. Here, inparticular, the first and second large substrates to each other by theadhesive sheet which is formed to surround each of the irradiating partand the light receiving part on the first large substrate and which ismade of the light shielding adhesive. Thus, it is possible to easilyform the adhesive part which is made only of the light shieldingadhesive. Moreover, after the first and second large substrates arebonded to each other, the first and second large substrates are cutalong the circumference of the substrate. Thus, it is possible tomanufacture a plurality of light-emitting sensor devices,simultaneously.

The above object of the present invention can be also achieved by athird method of manufacturing a light-emitting sensor device providedwith: a substrate; an irradiating part, disposed on the substrate, forapplying light to a specimen; a light receiving part, disposed on thesubstrate, for detecting light from the specimen caused by the appliedlight; a front plate disposed to face the substrate, on a front surfaceside of the substrate in which the irradiating part is disposed; and anadhesive part which is formed to surround each of the irradiating partand the light receiving part viewed in a two-dimensional manner on thesubstrate, which includes a light shielding adhesive, and which bondsthe substrate and the front plate to each other, the method providedwith: a forming process of forming the irradiating part and the lightreceiving part on a first large substrate including a plurality ofsubstrates; an applying process of applying the light shielding adhesiveto a large frame member by dipping, the large frame member having higherstrength than the light shielding adhesive, the large frame member beingformed to surround each of the irradiating part and the light receivingpart viewed in a two-dimensional manner on the first large substrate; anadhering process of disposing a second large substrate including aplurality of front plates so as to face the first large substrate viathe large frame member to which the light shielding adhesive is appliedand of bonding the first and second large substrates to each other bythe light shielding adhesive; and a cutting process of cutting the firstand second large substrates bonded to each other, along circumference ofthe substrate.

According to the third method of manufacturing a light-emitting sensordevice of the present invention, the aforementioned light-emittingsensor device of the present invention can be manufactured. Here, inparticular, the light shielding adhesive is applied to the large framemember by dipping. Thus, it is possible to easily form the adhesive partwhich is made of the frame member and the light shielding adhesive.Moreover, after the first and second large substrates are bonded to eachother, the first and second large substrates are cut along thecircumference of the substrate. Thus, it is possible to manufacture aplurality of light-emitting sensor devices, simultaneously.

The above object of the present invention can be also achieved by afourth method of manufacturing a light-emitting sensor device providedwith: a substrate; an irradiating part, disposed on the substrate, forapplying light to a specimen; a light receiving part, disposed on thesubstrate, for detecting light from the specimen caused by the appliedlight; a front plate disposed to face the substrate, on a front surfaceside of the substrate in which the irradiating part is disposed; and anadhesive part which is formed to surround each of the irradiating partand the light receiving part viewed in a two-dimensional manner on thesubstrate, which includes a light shielding adhesive, and which bondsthe substrate and the front plate to each other, the method providedwith: a forming process of forming the irradiating part and the lightreceiving part on a first large substrate including a plurality ofsubstrates; an applying process of applying the light shielding adhesiveto a first surface opposed to the first large substrate and a secondsurface opposite to the first surface, in a large frame member which hashigher strength than the light shielding adhesive and which is formed tosurround each of the irradiating part and the light receiving partviewed in a two-dimensional manner on the first large substrate; anadhering process of disposing a second large substrate including aplurality of front plates so as to face the first large substrate viathe large frame member to which the light shielding adhesive is appliedand of bonding the first and second large substrates to each other bythe light shielding adhesive via the large frame member; and a cuttingprocess of cutting the first and second large substrates bonded to eachother, along circumference of the substrate.

According to the fourth method of manufacturing a light-emitting sensordevice of the present invention, the aforementioned light-emittingsensor device of the present invention can be manufactured. Here, inparticular, the light shielding adhesive is applied to the first surface(i.e. a lower surface) opposed to the first large substrate and thesecond surface (i.e. an upper surface) opposite to the first surface, inthe large frame member, by using a roller or the like. Thus, it ispossible to easily form the adhesive part having the structure that theupper surface and the lower surface of the frame member are covered withthe light shielding adhesive. Moreover, after the first and second largesubstrates are bonded to each other, the first and second largesubstrates are cut along the circumference of the substrate. Thus, it ispossible to manufacture a plurality of light-emitting sensor devices,simultaneously.

The operation and other advantages of the present invention will becomemore apparent from the embodiments explained below.

As explained in detail above, according to the light-emitting sensordevice of the present invention, it is provided with the substrate, theirradiating part, the light receiving part, the front plate, and theadhesive part. Thus, it is possible to detect the predetermined type ofinformation, such as a blood flow velocity, on the specimen, highlyaccurately. Moreover, it is possible to increase the yield and to reducethe manufacturing cost, and it is suitable for mass production.Moreover, according to the first to fourth methods of manufacturing alight-emitting sensor device of the present invention, it is possible tomanufacture the light-emitting sensor device of the present inventiondescribed above.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a plan view showing the structure of a sensor part of a bloodflow sensor device in a first embodiment.

FIG. 2 is an A-A′ cross sectional view in FIG. 1.

FIG. 3 is a plan view showing the structure of a front plate of theblood flow sensor device in the first embodiment.

FIG. 4 is a cross sectional view having the same concept as in FIG. 2 ina first modified example.

FIG. 5 is a cross sectional view having the same concept as in FIG. 2 ina second modified example.

FIG. 6 is a block diagram showing the structure of the blood flow sensordevice in the first embodiment.

FIG. 7 is a conceptual view showing one example of how to use the bloodflow sensor device in the first embodiment.

FIG. 8 is a plan view showing the structure of a sensor part of a bloodflow sensor device in a second embodiment.

FIG. 9 is a B-B′ cross sectional view in FIG. 8.

FIG. 10 is a cross sectional view having the same concept as in FIG. 2in a third embodiment.

FIG. 11 is a flowchart showing a flow of a method of manufacturing thelight-emitting sensor device in a first embodiment.

FIG. 12 is a plan view showing a sensor part substrate wafer after alaser diode, a photodiode and the like are formed.

FIG. 13 is a conceptual view showing a process of applying an adhesivein the method of manufacturing the light-emitting sensor device in thefirst embodiment.

FIG. 14 is a flowchart showing a flow of a method of manufacturing thelight-emitting sensor device in a second embodiment.

FIG. 15 is a conceptual view showing a process of setting an adhesiveseal in the method of manufacturing the light-emitting sensor device inthe second embodiment.

FIG. 16 is a flowchart showing a flow of a method of manufacturing thelight-emitting sensor device in a third embodiment.

FIG. 17 is a perspective view showing a large frame member in the methodof manufacturing the light-emitting sensor device in the thirdembodiment.

FIG. 18 is a cross sectional view showing that a sensor part substratewafer and a front plate array substrate are disposed to face each othervia the large frame member after a light shielding adhesive is appliedby dipping, in the method of manufacturing the light-emitting sensordevice in the third embodiment.

FIG. 19 is a flowchart showing a flow of a method of manufacturing thelight-emitting sensor device in a fourth embodiment.

FIG. 20 is a cross sectional view showing that the sensor part substratewafer and the front plate array substrate are disposed to face eachother via the large frame member to which the light shielding adhesiveis applied, in the method of manufacturing the light-emitting sensordevice in the fourth embodiment.

DESCRIPTION OF REFERENCE CODES

-   100, 102, 103 sensor part-   110 sensor part substrate-   120 laser diode-   130 electrode-   150 laser diode drive circuit-   160 photodiode-   170 photodiode amplifier-   180, 200, 201 adhesive part-   189 adhesive sheet-   190 front plate-   210 adhesive portion-   220 frame member-   310 A/D converter-   320 blood flow velocity DSP-   510 sensor part substrate wafer-   601 large frame member-   710 front plate array substrate-   910 dispenser

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be explained withreference to the drawings. Incidentally, the embodiments below exemplifya blood flow sensor device, which is one example of the light-emittingsensor device of the present invention.

<First Embodiment of Light-Emitting Sensor Device>

A blood flow sensor device in a first embodiment will be explained withreference to FIG. 1 to FIG. 7.

Firstly, the structure of a sensor part of the blood flow sensor devicein the first embodiment will be explained with reference to FIG. 1 toFIG. 3.

FIG. 1 is a plan view showing the structure of the sensor part of theblood flow sensor device in the first embodiment. FIG. 2 is an A-A′cross sectional view in FIG. 1. Incidentally, in FIG. 1, for convenienceof explanation, the illustration of a front plate 190 shown in FIG. 2 isomitted.

As shown in FIG. 1 and FIG. 2, a sensor part 100 of the blood flowsensor device in the first embodiment is provided with a sensor partsubstrate 110, a laser diode 120, an electrode 130, a wire line 140, alaser diode drive circuit 150, a photodiode 160, a photodiode amplifier170, an adhesive part 180, and a front plate 190.

The sensor part substrate 110 is made of a semiconductor substrate, suchas a silicon substrate. On the sensor part substrate 110, the laserdiode 120, the laser diode drive circuit 150, the photodiode 160, andthe photodiode amplifier 170 are integrated and disposed.

The laser diode 120 is one example of the “irradiating part” of thepresent invention, and it is a semiconductor laser for emitting laserlight. The laser diode 120 is electrically connected to the electrode130 through the wire line 140. The electrode 130 is electricallyconnected to an electrode pad (not illustrated) disposed on the bottomof the sensor part substrate 100 by wiring (not illustrate) whichpenetrates the sensor part substrate 110. Moreover, the other electrode(not illustrate) formed on the bottom surface of the laser diode 120 iselectrically connected to an electrode pad (not illustrated) disposed onthe bottom of the sensor part substrate 100 by wiring (not illustrate)on the sensor substrate or wiring (not illustrate) which penetrates thesensor part substrate 110, and it can drive the laser diode 120 bycurrent injection from the exterior of the sensor part 100.

The laser diode drive circuit 150 is a circuit for controlling the driveof the laser diode 120, and it controls the amount of an electriccurrent injected to the laser diode 120.

The photodiode 160 is one example of the “light receiving part” of thepresent invention, and it functions as a light detector for detectingthe light reflected or scattered from a specimen. Specifically, thephotodiode 160 can obtain information about light intensity byconverting the light to an electric signal. The photodiode 160 isdisposed in parallel with the laser diode 120 on the sensor partsubstrate 110. The light received on the photodiode 160 is converted tothe electric signal and is inputted to the photodiode amplifier 170 viaa wire line (not illustrated) and an electrode (not illustrated) formedon the bottom surface of the photodiode 160 or the like.

The photodiode amplifier 170 is an amplifier circuit for amplifying theelectric signal obtained by the photodiode 160. The photodiode amplifier170 is electrically connected to the electric pad (not illustrated)disposed on the bottom of the sensor part substrate 100 by the wiring(not illustrate) which penetrates the sensor part substrate 110, and itcan output the amplified electric signal to the exterior. The photodiodeamplifier 170 is electrically connected to an A/D (Analog to Digital)converter 310 (refer to FIG. 6 described later) disposed in the exteriorof the sensor part 100.

The adhesive part 180 is made of a light shielding adhesive, and itbonds the sensor part substrate 110 and the front plate 190. The lightshielding adhesive may be an acrylic, epoxy, polyimide or silicon typeadhesive in which conducting particles, such as carbon black, aluminumand silver, are dispersed inside, or an acrylic, epoxy, polyimide orsilicon type adhesive in which pigments, such as black pigments, aredispersed inside. The adhesive 180 is formed to surround each of thelaser diode 120 and the photo diode 160, viewed in a two-dimensionalmanner on the sensor part substrate 110. More specifically, the adhesivepart 180 is formed in a wall shape on the sensor part substrate 110,having; a first wall portion 181 formed along a circumference on thesensor part substrate 110; and a second wall portion 182 formed betweenthe laser diode 120 and the photodiode 160 on the sensor part substrate110. The first wall portion 181 is formed to surround all the laserdiode 120, the electrode 130, the wire line 140, the laser diode drivecircuit 160, the photo diode 160, and the photodiode amplifier 170,viewed in a two-dimensional manner on the sensor part substrate 110.Thus, by virtue of the first wall portion 181, it is possible to preventthe light from the surroundings of the sensor part 100 from enteringinto the sensor part 100 (i.e. inner than the first wall portion 181 onthe sensor part substrate 110). The second wall portion 182 is formed toconnect a portion formed along one side of the sensor part substrate 110of the first wall portion 181 and a portion formed along the other sideopposed to the one side of the first wall portion 181, between the laserdiode 120 and the photodiode 160 on the sensor part substrate 110. Byvirtue of the second wall portion 182, it is possible to shield betweenthe laser diode 120 and the photodiode 160 from the light. Thus, forexample, it is possible to block the light going to the photodiode 160as it is, without being applied to the specimen, out of the lightemitted from the laser diode 120. In other words, it is possible toprevent the light which does not have to be detected by the photodiode160 from entering the photodiode 160 from the laser diode 120 side tothe photodiode 160 side on the sensor part substrate 110, therebyincreasing the detection accuracy.

The front plate 190 is disposed above the laser diode 120, thephotodiode 160, and the like (in other words, at a predeterminedinterval from the sensor part substrate 110, on the front surface sideof the sensor part substrate 110 where the laser diode 120 and the likeare disposed). In other words, the front plate 190 is disposed to facethe sensor part substrate 110 via the adhesive part 180.

FIG. 3 is a plan view showing the structure of the front plate of theblood flow sensor device in the first embodiment.

As shown in FIG. 2 and FIG. 3, the font plate 190 is provided with atransparent substrate 190 a and a light shielding film 195.

The transparent substrate 190 a is a transparent substrate which cantransmit the light from the laser diode 120 and the light from thespecimen. As the transparent substrate 190 a, for example, a resinsubstrate, a glass substrate, or the like can be used.

The light shielding film 195 is disposed each of two substrate surfacesof the transparent substrate 190 a (i.e. the substrate surface opposedto the sensor part substrate 110, and the substrate surface opposite tothe above substrate surface. The light shielding film 195 defines anexit aperture 191 for letting out or emitting the light from the laserdiode 120 to the exterior, and an entrance aperture 192 for letting inthe light reflected or scattered from the specimen. The light shieldingfilm 195 limits the light entering the photodiode 160 and allows theincidence of only the light from directly above (i.e. in a top-to-bottomdirection in FIG. 2). Thus, it is possible to prevent the light thatdoes not have to be detected from entering the photodiode 160, therebyincreasing the detection accuracy. Incidentally, the diameter of theentrance aperture 192 is, for example, about 40 μm.

FIG. 4 is a cross sectional view having the same concept as in FIG. 2 ina first modified example.

As shown in FIG. 4, the entrance aperture 192 may be formed as a pinhole(or through hole) which penetrates through the transparent substrate 190a. The pinhole-shaped formation of the entrance aperture 192 allows theincidence of only the light from directly above (i.e. in a top-to-bottomdirection in FIG. 2). In this case, by forming the light shielding film195 on the inner wall of the entrance aperture 192 formed as the pinholeas well, it is possible to remove a path in which one portion of thelight to be emitted from the exit aperture 191 can enter the photodiode160 from the entrance aperture 192 via the inside of the front plate 190(i.e. the transparent substrate 190 a), thereby further increasing thedetection accuracy.

FIG. 5 is a cross sectional view having the same concept as in FIG. 2 ina second modified example.

As shown as the second modified example in FIG. 5, the sensor part 100may be provided with a front plate 190 a made of a light shieldingmaterial, instead of the front plate 190. In the front plate 190 b, eachof the exit aperture 191 and the entrance aperture 192 is formed as apinhole which penetrates through the front plate 190 b. In this case, itis not necessary to form the aforementioned light shielding film 195.

Incidentally, a protective plate made of a transparent substrate, suchas a resin substrate and a glass substrate, may be disposed on the uppersurface side of the front plate 190. In this case, the protective platecan increase the durability of the sensor part 100. Moreover, the sameeffect can be obtained by molding (or shaping) the entire front plate orthe portion where the through hole is formed with resin which istransparent to the light from the laser diode 120, or by filling thethrough hole with the transparent resin or the like.

The sensor part substrate 110 is desirably a substrate made of a lightshielding material; however, it may be formed of a material throughwhich an infrared ray can be transmitter, such as Si (silicon), in orderto unify an electronic circuit and a photodiode. In this case, a lightshielding process may be performed separately by using a light shieldingresist or the like.

Back in FIG. 1 and FIG. 2 again, particularly in the first embodiment,as described above, the sensor part substrate 110 on which the laserdiode 120, the photodiode 160 and the like are formed and the frontplate 190 are bonded to each other by the adhesive part 180. In otherwords, the sensor part 100 of the blood flow sensor device in the firstembodiment has a laminated structure in which the sensor part substrate110 on which the laser diode 120, the photodiode 160 and the like areformed and the front plate 190 are laminated via the adhesive part 180.Moreover, to put it another way, the sensor part 100 of the blood flowsensor device in the first embodiment has a relatively simple structure,which is a trilaminar structure, in which the sensor part substrate 110,the adhesive part 180, and the front plate 190 are laminated in thisorder. Thus, it is possible to simplify or reduce each process in amanufacturing process. Therefore, it is possible to increase a yield,thereby reducing manufacturing cost.

Next, the structure of the entire blood flow sensor device in the firstembodiment will be explained with reference to FIG. 6.

FIG. 6 is a block diagram showing the structure of the blood flow sensordevice in the first embodiment.

In FIG. 6, the blood flow sensor device in the first embodiment isprovided with an A/D converter 310 and a blood flow velocity digitalsignal processor (DSP) 320, in addition to the aforementioned sensorpart 100. Incidentally, in this embodiment, the laser diode drivecircuit 150 and the photodiode amplifier 179 are formed on the sensorpart substrate; however, they may be provided separately from the sensorpart 100 without being formed on the sensor part substrate 110 as in theA/D converter 310 and the blood flow velocity DSP 320, or they may beunified on the sensor part substrate 110 including the A/D converter 310and the blood flow velocity DSP 320. Alternatively, other substrateshaving their respective functions may be laminated with the sensor partsubstrate 110, and they may be mounted in an electrically connectingmethod or the like by wiring and through-hole interconnection. Bybringing the A/D converter 310 and the blood flow velocity DSP 320 closeto the sensor part substrate 110, a sufficient SN ratio (Signal to NoiseRatio) and a sufficient band can be ensured in weak or faint signalprocessing.

The A/D converter 310 converts the electric signal outputted from thephotodiode amplifier 170, from an analog signal to a digital signal. Inother words, the electric signal obtained by the photodiode 160 isamplified by the photodiode amplifier 170, and then it is converted tothe digital signal by the A/D converter 310. The A/D converter 310outputs the digital signal to the blood flow velocity DSP 320.

The blood flow velocity DSP 320 is one example of the “calculating part”of the present invention, and it calculates the blood flow velocity byperforming a predetermined arithmetic process on the digital signalinputted from the A/D converter 310.

Next, the measurement of the blood flow velocity by the blood flowsensor device in the first embodiment will be explained with referenceto FIG. 7 in addition to FIG. 6.

FIG. 7 is a conceptual view showing one example of how to use the bloodflow sensor device in the first embodiment.

As shown in FIG. 7, the blood flow sensor device in the first embodimentmeasures the blood flow velocity by irradiating a fingertip 500, whichis one example of the specimen, with laser light with a predeterminedwavelength (e.g. shortwave light with a wavelength of 780 nm, orlong-wave light with a wavelength of 830 nm) by using the laser diode120. At this time, a portion irradiated with the laser light is moredesirably a portion in which blood capillaries are distributed denselyin a position relatively close to the epidermis (e.g. hand, leg, face,ear, or the like). Incidentally, in FIG. 7, an arrow P1 conceptuallyshows the light emitted from the sensor part 100. Moreover, in themeasurement of the blood flow velocity, the blood flow sensor device inthe first embodiment is typically used in the condition that thefingertip 500 touches the upper surface of the sensor part 100 (i.e. theupper surface of the front plate 190); however, for convenience ofexplanation, FIG. 7 shows a gap between the fingertip 500 and the sensorpart 100. However, according to the blood flow sensor device in thefirst embodiment, it is possible to measure the blood flow velocity evenif the fingertip 500 does not touch the upper surface of the sensor part100.

In FIG. 7, the laser light applied to the fingertip 500 penetrates todepth according to its wavelength, and it is reflected or scattered bythe body tissue of the fingertip 500, such as blood flowing in bloodvessels like the blood capillaries or the like and skin cells whichconstitute the epidermis. In general, the light with a longer wavelengthallows the measurement in a deeper portion. Incidentally, in FIG. 7, anarrow P2 conceptually shows the light entering the sensor part 100 afterbeing reflected or scattered by the body tissue of the fingertip 500.Then, the Doppler shift occurs in the light reflected or scattered byred blood cells flowing in the blood vessels, and the wavelength of thelight changes depending on the transfer rate of the red blood cells orthe rate at which the blood flows (i.e. the blood flowing velocity). Onthe other hand, as for the light reflected or scattered by the skincells or the like which can be considered immovable with respect to thered blood cells, the wavelength of the light does not change. By thoselights interfering with each other, an optical beat signal correspondingto the Doppler shift amount is detected on the photodiode 160 (refer toFIG. 6). The blood flow velocity DSP 320 (refer to FIG. 6) performsfrequency analysis on the optical beat signal detected by the photodiode160 and calculates the Doppler shift amount, thereby calculating theblood flow velocity.

As explained in detail above, according to the blood flow sensor devicein the first embodiment, it is provided with the adhesive part 180 madeof the light shielding adhesive, so that it is possible to prevent thelight which does not have to be detected by the photodiode 160 fromentering the photodiode 160. Thus, the blood flow velocity in thespecimen can be detected highly accurately. Moreover, according to theblood flow sensor device in the first embodiment, the sensor part 100has a relatively simple structure, which is a trilaminar structure, inwhich the sensor part substrate 110, the adhesive part 180, and thefront plate 190 are laminated in this order. Thus, it is possible toincrease the yield and to reduce the manufacturing cost, and it issuitable for mass production.

<Second Embodiment of Light-Emitting Sensor Device>

A blood flow sensor device in a second embodiment will be explained withreference to FIG. 8 and FIG. 9.

Firstly, the structure of a sensor part of the blood flow sensor devicein the first embodiment will be explained with reference to FIG. 1 toFIG. 3. FIG. 8 is a plan view showing the structure of a sensor part ofthe blood flow sensor device in the second embodiment. FIG. 9 is a B-B′cross sectional view in FIG. 8. Incidentally, in FIG. 8, for convenienceof explanation, the illustration of the front plate 190 shown in FIG. 9is omitted, and it shows a cross sectional view of an adhesive part 200in a case where the adhesive part 200 is cut so as to include a framemember 220 on a plane along the substrate surface of the sensor partsubstrate 110. Incidentally, in FIG. 8 and FIG. 9, the same constituentsas those in the first embodiment shown in FIG. 1 to FIG. 7 will carrythe same reference numerals, and the explanation thereof will beomitted, as occasion demands.

The blood flow sensor apparatus in the second embodiment is differentfrom the blood flow sensor apparatus in the first embodiment describedabove in the point that it is provided with a sensor part 102 instead ofthe sensor part 100 in the first embodiment described above, and it isconstructed in substantially the same manner as the blood flow sensorapparatus in the first embodiment described above in other points.

In FIG. 8 and FIG. 9, the sensor part 102 of the blood flow sensorapparatus in the second embodiment is different from the sensor part 100of the blood flow sensor apparatus in the first embodiment describedabove in the point that it is provided with the adhesive part 200instead of the adhesive part 180 in the first embodiment describedabove, and it is constructed in substantially the same manner as thesensor part 100 of the blood flow sensor apparatus in the firstembodiment described above in other points.

As shown in FIG. 8 and FIG. 9, the adhesive part 200 is made of anadhesive portion 210 and a frame member 220. The adhesive part 200 isformed to surround each of the laser diode 120 and the photo diode 160,viewed in a two-dimensional manner on the sensor part substrate 110.

The adhesive portion 210 is made of a light shielding adhesive, and itis formed to cover the upper surface of the frame member 220 (i.e. asurface of the frame member 220 opposed to the front plate 190), thelower surface (i.e. a surface of the frame member 220 opposed to thesensor part substrate 110) and one portion of the side surfaces (morespecifically, a side surface opposed to the laser diode 120 and a sidesurface opposed to the photodiode 160, in the frame member 220). Thelight shielding adhesive may be an acrylic, epoxy, polyimide or silicontype adhesive in which conducting particles, such as carbon black,aluminum and silver, are dispersed inside, or an acrylic, epoxy,polyimide or silicon type adhesive in which pigments, such as blackpigments, are dispersed inside.

The frame member 220 is, for example, made of resin or the like, havinghigher strength than the adhesive portion 210, and it is formed tosurround each of the laser diode 120 and the photo diode 160, viewed ina two-dimensional manner on the sensor part substrate 110. The framemember 220 may be formed of, for example, silicon, metal, ceramics, orthe like, having higher strength than the adhesive portion 210.

As described above, particularly in the second embodiment, the adhesivepart 200 is made of the adhesive portion 210 and the frame member 220,so that it is possible to increase the strength of the adhesive part 200in comparison with a case where the adhesive part 200 does not have theframe member 220 (i.e. the adhesive part 200 is made only of theadhesive). Thus, a change in gap between the sensor part substrate 110and the front plate 190 can be limited or controlled. Therefore, it ispossible to prevent a reduction in detection accuracy.

Incidentally, according to the second embodiment, one portion of theadhesive portion 210 covers the side surface opposed to the laser diode120 and the side surface opposed to the photodiode 160 in the framemember 220, so that the frame member 220 can be formed of a transparentmaterial. The frame member 220 may be formed of a material having alight shielding property.

<Third Embodiment of Light-Emitting Sensor Device>

A blood flow sensor device in a third embodiment will be explained withreference to FIG. 10.

FIG. 10 is a cross sectional view having the same concept as in FIG. 2in the third embodiment. Incidentally, in FIG. 10, the same constituentsas those in the first embodiment shown in FIG. 1 to FIG. 7 will carrythe same reference numerals, and the explanation thereof will beomitted, as occasion demands.

The blood flow sensor apparatus in the third embodiment is differentfrom the blood flow sensor apparatus in the first embodiment describedabove in the point that it is provided with a sensor part 103 instead ofthe sensor part 100 in the first embodiment described above, and it isconstructed in substantially the same manner as the blood flow sensorapparatus in the first embodiment described above in other points.

In FIG. 10, the sensor part 103 of the blood flow sensor apparatus inthe second embodiment is different from the sensor part 100 of the bloodflow sensor apparatus in the first embodiment described above in thepoint that it is provided with an adhesive part 201 instead of theadhesive part 180 in the first embodiment described above, and it isconstructed in substantially the same manner as the sensor part 100 ofthe blood flow sensor apparatus in the first embodiment described abovein other points.

As shown in FIG. 10, the adhesive part 201 is made of an adhesiveportion 211 and a frame member 221.

The frame member 221 is formed substantially as in the frame member 220in the second embodiment described above with reference to FIG. 8 andFIG. 9. In other words, the frame member 221 is made of resin or thelike, having higher strength than the adhesive portion 211 and having alight shielding property, and it is formed to surround each of the laserdiode 120 and the photo diode 160, viewed in a two-dimensional manner onthe sensor part substrate 110. The frame member 221 may be formed of,for example, silicon, metal, ceramics, or the like.

The adhesive portion 211 is made of a light shielding adhesive, and itis formed to cover the upper surface of the frame member 221 (i.e. asurface of the frame member 221 opposed to the front plate 190) and thelower surface (i.e. a surface of the frame member 221 opposed to thesensor part substrate 110) but not formed on the side surfaces of theframe member 221. The light shielding adhesive may be an acrylic, epoxy,polyimide or silicon type adhesive in which conducting particles, suchas carbon black, aluminum and silver, are dispersed inside, or anacrylic, epoxy, polyimide or silicon type adhesive in which pigments,such as black pigments, are dispersed inside.

As described above, particularly in the third embodiment, the adhesivepart 201 is made of the adhesive portion 211 and the frame member 221,so that it is possible to increase the strength of the adhesive part 201in comparison with a case where the adhesive part 201 does not have theframe member 221 (i.e. the adhesive part 201 is made only of the lightshielding adhesive). Thus, a change in gap between the sensor partsubstrate 110 and the front plate 190 can be limited or controlled.

Incidentally, according to the third embodiment, the adhesive part 201is provided with the frame member 221 having a light shielding propertyand the adhesive portion 211 made of the light shielding adhesive, sothat it is possible to prevent the light detected by the photodiode 160from changing due to unnecessary light from the surroundings of thesensor part 103 and light directly going from the laser diode 120 to thephotodiode 160.

<First Embodiment of Method of Manufacturing Light-Emitting SensorDevice>

A method of manufacturing the light-emitting sensor device in a firstembodiment will be explained with reference to FIG. 11 to FIG. 13.Incidentally, the method of manufacturing the light-emitting sensordevice in the first embodiment is one example of the first method ofmanufacturing the light-emitting sensor device of the present invention,and it is possible to manufacture the blood flow sensor device in thefirst embodiment described above. Hereinafter, a detailed explanationwill be given on a method of manufacturing the sensor part 100 of theblood flow sensor device in the first embodiment described above.

FIG. 11 is a flowchart showing a flow of the method of manufacturing thelight-emitting sensor device in the first embodiment. FIG. 12 is a planview showing a sensor part substrate wafer after the laser diode, thephotodiode and the like are formed. FIG. 13 is a conceptual view showinga process of applying the adhesive in the method of manufacturing thelight-emitting sensor device in the first embodiment.

In FIG. 11 and FIG. 12, firstly, the laser diode 120, the photodiode 160and the like are formed on a sensor part substrate wafer 510 (step S10).The sensor part substrate wafer 510 is one example of the “first largesubstrate” of the present invention, and it is a semiconductor waferincluding a plurality of sensor part substrates 110 (refer to FIG. 1 andFIG. 2). More specifically, after the laser diode drive circuit 150, thephotodiode 160, the photodiode amplifier 170, and the electrode 130 areformed on the sensor part substrate wafer 510 by using a semiconductorprocess technology, the laser diode 120 is mounted.

Then, the light shielding adhesive is applied on the sensor partsubstrate wafer 510 by using a dispenser (step S11). In other words, asshown in FIG. 12 and FIG. 13, a light shielding adhesive 185 is appliedto an adhesive area 180 a on the sensor part substrate wafer 510 byusing a dispenser 910. The adhesive area 180 a is defined in a gridshape which surrounds each of the laser diode 120 and the photodiode 160on the sensor part substrate wafer 510. As the light shielding adhesive185, for example, thermosetting resin is used in which conductingparticles, such as carbon black, aluminum and silver, are dispersedinside. The light shielding adhesive 185 may be thermosetting resin inwhich pigments, such as black pigments, are dispersed inside. After thelight shielding adhesive 185 is applied onto the sensor part substratewafer 510, the applied light shielding adhesive 185 is temporarilyhardened by heating it for a predetermined time. Incidentally, as thelight shielding adhesive, a pressure-sensitive adhesive having a lightshielding property may be used.

Then, the sensor part substrate wafer 510 and a front plate arraysubstrate are bonded to each other (step S12). The front plate arraysubstrate (not illustrated) is one example of the “second largesubstrate” of the present invention, and it is a substrate including aplurality of front plates 190 (refer to FIG. 2 and FIG. 3) (e.g. asubstrate in which the plurality of front plates 190 are arranged in amatrix shape). A process of forming such a front plate array substratemay be performed in advance, such as being performed in parallel withthe process of forming the laser diode and the like on the sensor partsubstrate wafer 510 (the step S10). Incidentally, in the process offorming the front plate array substrate, the light shielding film 195(refer to FIG. 2 and FIG. 3) is formed in a predetermined pattern in atransparent substrate wafer including a plurality of transparentsubstrates 190 a (refer to FIG. 2 and FIG. 3).

Specifically, the sensor part substrate wafer 510 to which the lightshielding adhesive 185 is applied and the front plate array substrateare disposed to face each other and are positioned. Then, the lightshielding adhesive 185 is pressured by bringing the sensor partsubstrate wafer 510 and the front plate array substrate close to eachother at a predetermined distance. Then, the light shielding adhesive185 is hardened by heating, by which the sensor part substrate wafer 510and the front plate array substrate are bonded to each other by thelight shielding adhesive 185.

Then, the sensor part substrate wafer 510, the front plate arraysubstrate, and the light shielding adhesive 185 are cut along a sectionline L1 (step S13). The section line L1 is defined along thecircumference of each of the plurality of sensor part substrates 110 onthe sensor part substrate wafer 510. The sensor part substrate wafer510, the front plate array substrate, and the light shielding adhesive185 are cut along the section line L1, for example, by dicing or diecutting. By this, a plurality of sensor parts 100 can be manufacturedsimultaneously.

As explained above, according to the method of manufacturing thelight-emitting sensor device in the first embodiment, it is possible tomanufacture the sensor part 100 of the blood flow sensor device in thefirst embodiment described above. Here, particularly in this embodiment,the light shielding adhesive 185 is applied by the dispenser 910 so asto surround each of the laser diode 120 and the photodiode 160 on thesensor part substrate wafer 510, which facilitates the formation of theadhesive part 180 (refer to FIG. 1 and FIG. 2) made only of the lightshielding adhesive 185. Moreover, after the sensor part substrate wafer510 and the front plate array substrate are bonded to each other by thelight shielding adhesive 185, the sensor part substrate wafer 510 andthe front plate array substrate are cut along the section line L1, whichallows a plurality of sensor parts 100 to be manufacturedsimultaneously.

<Second Embodiment of Method of Manufacturing Light-Emitting SensorDevice>

A method of manufacturing the light-emitting sensor device in a secondembodiment will be explained with reference to FIG. 14 and FIG. 15.Incidentally, the method of manufacturing the light-emitting sensordevice in the second embodiment is one example of the second method ofmanufacturing the light-emitting sensor device of the present invention,and it is possible to manufacture the blood flow sensor device in thefirst embodiment described above. Hereinafter, a detailed explanationwill be given on a method of manufacturing the sensor part 100 of theblood flow sensor device in the first embodiment described above.

FIG. 14 is a flowchart showing a flow of the method of manufacturing thelight-emitting sensor device in the second embodiment. FIG. 15 is aconceptual view showing a process of setting an adhesive seal in themethod of manufacturing the light-emitting sensor device in the secondembodiment. Incidentally, in FIG. 14 and FIG. 15, the same manufacturingprocesses and constituents as those in the method of manufacturing thelight-emitting sensor device in the first embodiment shown in FIG. 11 toFIG. 13 will carry the same reference numerals, and the explanationthereof will be omitted, as occasion demands.

In FIG. 14 and FIG. 15, firstly, the laser diode 120, the photodiode 160and the like are formed on the sensor part substrate wafer 510 (the stepS10).

Then, an adhesive sheet 189 made of a light shielding adhesive isdisposed on the sensor part substrate wafer 510 (step S21). In otherwords, as shown in FIG. 15, an adhesive sheet 189 in a grid shape, whichcan surround each of the laser diode 120 and the photodiode 160, isdisposed such that it overlaps the adhesive area 180 a. The adhesivesheet 189 is a thermosetting or pressure-sensitive adhesive sheet. Inthe adhesive sheet 189, pigments, such as black pigments, are dispersedinside, and the adhesive sheet 189 has a light shielding property.

Then, the sensor part substrate wafer 510 and the front plate arraysubstrate are bonded to each other (step S22). More specifically, thesensor part substrate wafer 510 in which the adhesive sheet 189 isdisposed and the front plate array substrate are disposed to face eachother and are positioned. Then, if the adhesive sheet 189 is apressure-sensitive adhesive sheet, the adhesive sheet 189 is pressuredby bringing the sensor part substrate wafer 510 and the front platearray substrate close to each other at a predetermined distance, bywhich the sensor part substrate wafer 510 and the front plate arraysubstrate are bonded to each other by the adhesive sheet 189.Alternatively, if the adhesive sheet 189 is a thermosetting adhesivesheet, the adhesive sheet 189 is hardened by heating, by which thesensor part substrate wafer 510 and the front plate array substrate arebonded to each other by the adhesive sheet 189.

Then, the sensor part substrate wafer 510, the front plate arraysubstrate, and the adhesive sheet 189 are cut along the section line L1(step S23). In other words, the sensor part substrate wafer 510, thefront plate array substrate, and the adhesive sheet 189 are cut alongthe section line L1, for example, by dicing or die cutting. By this, aplurality of sensor parts 100 can be manufactured simultaneously.

As explained above, according to the method of manufacturing thelight-emitting sensor device in the second embodiment, it is possible tomanufacture the sensor part 100 of the blood flow sensor device in thefirst embodiment described above. Here, particularly in this embodiment,the sensor part substrate wafer 510 and the front plate array substrateare bonded to each other by the adhesive sheet 189, which is formed tosurround each of the laser diode 120 and the photodiode 160 on thesensor part substrate wafer 510 and which is made of the light shieldingadhesive, which facilitates the formation of the adhesive part 180 madeonly of the light shielding adhesive. Moreover, after the sensor partsubstrate wafer 510 and the front plate array substrate are bonded toeach other by the adhesive sheet 189, the sensor part substrate wafer510 and the front plate array substrate are cut along the section lineL1, which allows a plurality of sensor parts 100 to be manufacturedsimultaneously.

<Third Embodiment of Method of Manufacturing Light-Emitting SensorDevice>

A method of manufacturing the light-emitting sensor device in a thirdembodiment will be explained with reference to FIG. 16 to FIG. 18.Incidentally, the method of manufacturing the light-emitting sensordevice in the third embodiment is one example of the third method ofmanufacturing the light-emitting sensor device of the present invention,and it is possible to manufacture the blood flow sensor device in thesecond embodiment described above. Hereinafter, a detailed explanationwill be given on a method of manufacturing the sensor part 102 of theblood flow sensor device in the second embodiment described above withreference to FIG. 8 and FIG. 9.

FIG. 16 is a flowchart showing a flow of the method of manufacturing thelight-emitting sensor device in the third embodiment. FIG. 17 is aperspective view showing a large frame member in the method ofmanufacturing the light-emitting sensor device in the third embodiment.FIG. 18 is a cross sectional view showing that the sensor part substratewafer and the front plate array substrate are disposed to face eachother via the large frame member after a light shielding adhesive isapplied by dipping, in the method of manufacturing the light-emittingsensor device in the third embodiment. Incidentally, in FIG. 16 to FIG.18, the same manufacturing processes and constituents as those in themethod of manufacturing the light-emitting sensor device in the firstembodiment shown in FIG. 11 to FIG. 13 will carry the same referencenumerals, and the explanation thereof will be omitted, as occasiondemands. Moreover, for convenience of explanation, FIG. 17 shows onlyone portion of the large frame member, but another portion isconstructed in the same manner.

In FIG. 16 and FIG. 17, firstly, the laser diode 120, the photodiode 160and the like are formed on the sensor part substrate wafer 510 (the stepS10).

Then, a large frame member is formed (step S31). In other words, a largeframe member 610 as shown in FIG. 16 is formed. More specifically, thelarge frame member 610 is formed in a grid shape which can surround eachof the laser diode 120 and the photodiode 160 on the sensor partsubstrate wafer 510. In other words, the large frame member 610 isformed in a plate shape having; a plurality of openings 611 each ofwhich corresponds to respective one of a plurality of laser diodes 120formed on the sensor part substrate wafer 510; and a plurality ofopenings each of which corresponds to respective one of a plurality ofphotodiodes 160 formed on the sensor part substrate wafer 510. The largeframe member 610 is formed, for example, by a resin molding technique,an etching technique, or the like. Incidentally, the process of formingthe large frame member 610 (the step S31) may be performed in advance,such as being performed in parallel with the process of forming thelaser diode 120 and the like on the sensor part substrate wafer 510 (thestep S10).

Then, the large frame member 610 is dipped in the light shieldingadhesive (step S32). In other words, by immersing or dipping the largeframe member 610 in the light shielding adhesive, the light shieldingadhesive is applied on the entire surface of the large frame member 610.By this, the entire surface of the large frame member 610 is covered(i.e. coated) with the light shielding adhesive.

Then, the sensor part substrate wafer 510 and the front plate arraysubstrate are bonded to each other via the large frame member 610 coatedwith the light receiving adhesive (step S33). More specifically, asshown in FIG. 18, the sensor part substrate wafer 510 and the frontplate array substrate are disposed to face each other via the largeframe member 610 coated with the light shielding adhesive 620, and arepositioned. Then, the light blocking adhesive 620 is hardened byheating, by which the sensor part substrate wafer 510 and the frontplate array substrate are bonded to each other by the light blockingadhesive 620.

Then, the sensor part substrate wafer 510, the front plate arraysubstrate 710, the large frame member 610, and the light shieldingadhesive 620 are cut along the section line L1, for example, by dicingor die cutting (step S34). By this, a plurality of sensor parts 102 canbe manufactured simultaneously.

As explained above, according to the method of manufacturing thelight-emitting sensor device in the third embodiment, it is possible tomanufacture the sensor part 102 of the blood flow sensor device in thesecond embodiment described above with reference to FIG. 9 and FIG. 10.Here, particularly in this embodiment, the light shielding adhesive 620is applied to the large frame member 610 by dipping, which facilitatesthe formation of the adhesive part 200 (refer to FIG. 9) made of theadhesive portion 210 and the frame member 220. Moreover, after thesensor part substrate wafer 510 and the front plate array substrate 710are bonded to each other by the light shielding adhesive 620, the sensorpart substrate wafer 510, the front plate array substrate 710, and thelarge frame member 610 are cut along the section line L1, which allows aplurality of sensor parts 102 to be manufactured simultaneously.

<Fourth Embodiment of Method of Manufacturing Light-Emitting SensorDevice>

A method of manufacturing the light-emitting sensor device in a fourthembodiment will be explained with reference to FIG. 19 and FIG. 20.Incidentally, the method of manufacturing the light-emitting sensordevice in the fourth embodiment is one example of the fourth method ofmanufacturing the light-emitting sensor device of the present invention,and it is possible to manufacture the blood flow sensor device in thethird embodiment described above. Hereinafter, a detailed explanationwill be given on a method of manufacturing the sensor part 103 of theblood flow sensor device in the third embodiment described above withreference to FIG. 10.

FIG. 19 is a flowchart showing a flow of the method of manufacturing thelight-emitting sensor device in the fourth embodiment. FIG. 20 is across sectional view showing that the sensor part substrate wafer andthe front plate array substrate are disposed to face each other via thelarge frame member to which the light shielding adhesive is applied, inthe method of manufacturing the light-emitting sensor device in thefourth embodiment. Incidentally, in FIG. 19 and FIG. 20, the samemanufacturing processes and constituents as those in the method ofmanufacturing the light-emitting sensor device in the third embodimentshown in FIG. 16 to FIG. 8 will carry the same reference numerals, andthe explanation thereof will be omitted, as occasion demands.

In FIG. 19, firstly, the laser diode 120, the photodiode 160 and thelike are formed on the sensor part substrate wafer 510 (the step S10).

Then, the large frame member is formed (the step S31). In other words,as in the method of manufacturing the light-emitting sensor device inthe third embodiment described above, the large frame member 610 asshown in FIG. 16 is formed.

Then, the light shielding adhesive is applied to the upper surface andlower surface of the large frame member 610 (step S42). In other words,in FIG. 16 and FIG. 20, for example, the light shielding adhesive of athermosetting type is applied to the upper surface of the large framemember 610 (i.e. the surface opposed to the front plate array substrate710) and the lower surface (i.e. the surface opposed to the sensor partsubstrate wafer 510) by using a roller or the like.

Then, the sensor part substrate wafer 510 and the front plate arraysubstrate 710 are bonded to each other via the large frame member 610 towhich the light receiving adhesive 620 is applied (step S43). Morespecifically, as shown in FIG. 20, the sensor part substrate wafer 510and the front plate array substrate 710 are disposed to face each othervia the large frame member 610 in which the light shielding adhesive 620is applied to the upper surface and lower surface thereof, and arepositioned. Then, the light blocking adhesive 620 is hardened byheating, by which the sensor part substrate wafer 510 and the frontplate array substrate 710 are bonded to each other via the large framemember 610 (i.e. the sensor part substrate wafer 510 and the large framemember 610 are bonded to each other by a portion of the light shieldingadhesive 620 applied to the lower surface of the large frame member 610,and the front plate array substrate 710 and the large frame member 610are bonded to each other by a portion of the light shielding adhesive620 applied to the upper surface of the large frame member 610).

Then, the sensor part substrate wafer 510, the front plate arraysubstrate 710, the large frame member 610, and the light shieldingadhesive 620 are cut along the section line L1, for example, by dicingor die cutting (the step S34). By this, a plurality of sensor parts 103(refer to FIG. 10 as well) can be manufactured simultaneously.

As explained above, according to the method of manufacturing thelight-emitting sensor device in the fourth embodiment, it is possible tomanufacture the sensor part 103 of the blood flow sensor device in thesecond embodiment described above with reference to FIG. 10. Here,particularly in this embodiment, the light shielding adhesive 620 isapplied to the upper surface and lower surface of the large frame member610 by using a roller or the like, which facilitates the formation ofthe adhesive part 201 (refer to FIG. 10) made of the adhesive portion211 and the frame member 221. Moreover, after the sensor part substratewafer 510 and the front plate array substrate 710 are bonded to eachother by the light shielding adhesive 620, the sensor part substratewafer 510, the front plate array substrate 710, and the large framemember 610 are cut along the section line L1, which allows a pluralityof sensor parts 103 to be manufactured simultaneously.

The present invention is not limited to the aforementioned example, butvarious changes may be made, if desired, without departing from theessence or spirit of the invention which can be read from the claims andthe entire specification. A light-emitting sensor device and a method ofmanufacturing the same, which involve such changes, are also intended tobe within the technical scope of the present invention.

INDUSTRIAL APPLICABILITY

The light-emitting sensor device and the method of manufacturing thesame of the present invention can be applied to a blood flow sensordevice or the like capable of measuring a blood flow velocity or thelike.

1. A light-emitting sensor device comprising: a substrate; anirradiating part, disposed on said substrate, for applying light to aspecimen; a light receiving part, disposed on said substrate, fordetecting light from the specimen caused by the applied light; a frontplate disposed to face said substrate, on a front surface side of saidsubstrate in which said irradiating part is disposed; and an adhesivepart which is formed to surround each of said irradiating part and saidlight receiving part viewed in a two-dimensional manner on saidsubstrate, which includes a light shielding adhesive, and which bondssaid substrate and said front plate to each other.
 2. The light-emittingsensor device according to claim 1, wherein said adhesive part is madeonly of the light shielding adhesive.
 3. The light-emitting sensordevice according to claim 1, wherein said adhesive part includes a framemember which has higher strength than the light shielding adhesive andwhich surrounds each of said irradiating part and said light receivingpart viewed in a two-dimensional manner on said substrate.
 4. Thelight-emitting sensor device according to claim 1, wherein the lightshielding adhesive is an acrylic, epoxy, polyimide or silicon typeadhesive in which light shielding particles are dispersed inside.
 5. Thelight-emitting sensor device according to claim 1, wherein saidirradiating part and said light receiving part are integrated on saidsubstrate.
 6. The light-emitting sensor device according to claim 1,further comprising a calculating part for calculating a blood flowvelocity associated with the specimen, on the basis of the detectedlight.
 7. The light-emitting sensor device according to claim 1, whereinsaid irradiating part has a semiconductor laser for generating laserlight as the light.
 8. A method of manufacturing a light-emitting sensordevice comprising: a substrate; an irradiating part, disposed on saidsubstrate, for applying light to a specimen; a light receiving part,disposed on said substrate, for detecting light from the specimen causedby the applied light; a front plate disposed to face said substrate, ona front surface side of said substrate in which said irradiating part isdisposed; and an adhesive part which is formed to surround each of saidirradiating part and said light receiving part viewed in atwo-dimensional manner on said substrate, which includes a lightshielding adhesive, and which bonds said substrate and said front plateto each other, said method comprising: a forming process of forming saidirradiating part and said light receiving part on a first largesubstrate including a plurality of substrates; an applying process ofapplying the light shielding adhesive so as to surround each of saidirradiating part and said light receiving part on the first largesubstrate; an adhering process of disposing a second large substrateincluding a plurality of front plates so as to face the first largesubstrate to which the light shielding adhesive is applied and ofbonding the first and second large substrates to each other by the lightshielding adhesive; and a cutting process of cutting the first andsecond large substrates bonded to each other, along circumference ofsaid substrate.
 9. A method of manufacturing a light-emitting sensordevice comprising: a substrate; an irradiating part, disposed on saidsubstrate, for applying light to a specimen; a light receiving part,disposed on said substrate, for detecting light from the specimen causedby the applied light; a front plate disposed to face said substrate, ona front surface side of said substrate in which said irradiating part isdisposed; and an adhesive part which is formed to surround each of saidirradiating part and said light receiving part viewed in atwo-dimensional manner on said substrate, which includes a lightshielding adhesive, and which bonds said substrate and said front plateto each other, said method comprising: a forming process of forming saidirradiating part and said light receiving part on a first largesubstrate including a plurality of substrates; a disposing process ofdisposing an adhesive sheet on the first large substrate, the adhesivesheet being formed to surround each of said irradiating part and saidlight receiving part on the first large substrate, the adhesive sheetbeing made of the light shielding adhesive; an adhering process ofdisposing a second large substrate including a plurality of front platesso as to face the first large substrate on which the adhesive sheet isdisposed and of bonding the first and second large substrates to eachother by the adhesive sheet; and a cutting process of cutting the firstand second large substrates bonded to each other, along circumference ofsaid substrate.
 10. A method of manufacturing a light-emitting sensordevice comprising: a substrate; an irradiating part, disposed on saidsubstrate, for applying light to a specimen; a light receiving part,disposed on said substrate, for detecting light from the specimen causedby the applied light; a front plate disposed to face said substrate, ona front surface side of said substrate in which said irradiating part isdisposed; and an adhesive part which is formed to surround each of saidirradiating part and said light receiving part viewed in atwo-dimensional manner on said substrate, which includes a lightshielding adhesive, and which bonds said substrate and said front plateto each other, said method comprising: a forming process of forming saidirradiating part and said light receiving part on a first largesubstrate including a plurality of substrates; an applying process ofapplying the light shielding adhesive to a large frame member bydipping, the large frame member having higher strength than the lightshielding adhesive, the large frame member being formed to surround eachof said irradiating part and said light receiving part viewed in atwo-dimensional manner on the first large substrate; an adhering processof disposing a second large substrate including a plurality of frontplates so as to face the first large substrate via the large framemember to which the light shielding adhesive is applied and of bondingthe first and second large substrates to each other by the lightshielding adhesive; and a cutting process of cutting the first andsecond large substrates bonded to each other, along circumference ofsaid substrate.
 11. A method of manufacturing a light-emitting sensordevice comprising: a substrate; an irradiating part, disposed on saidsubstrate, for applying light to a specimen; a light receiving part,disposed on said substrate, for detecting light from the specimen causedby the applied light; a front plate disposed to face said substrate, ona front surface side of said substrate in which said irradiating part isdisposed; and an adhesive part which is formed to surround each of saidirradiating part and said light receiving part viewed in atwo-dimensional manner on said substrate, which includes a lightshielding adhesive, and which bonds said substrate and said front plateto each other, said method comprising: a forming process of forming saidirradiating part and said light receiving part on a first largesubstrate including a plurality of substrates; an applying process ofapplying the light shielding adhesive to a first surface opposed to thefirst large substrate and a second surface opposite to the firstsurface, in a large frame member which has higher strength than thelight shielding adhesive and which is formed to surround each of saidirradiating part and said light receiving part viewed in atwo-dimensional manner on the first large substrate; an adhering processof disposing a second large substrate including a plurality of frontplates so as to face the first large substrate via the large framemember to which the light shielding adhesive is applied and of bondingthe first and second large substrates to each other by the lightshielding adhesive via the large frame member; and a cutting process ofcutting the first and second large substrates bonded to each other,along circumference of said substrate.